METHOD FOR PRODUCING AlN SINGLE CRYSTAL AND AlN SINGLE CRYSTAL

ABSTRACT

An AlN single crystal is grown by pressurizing a melt comprising at least gallium, aluminum and sodium in an atmosphere comprising nitrogen. Preferably, the AIN single crystal is grown under a nitrogen partial pressure of 50 atms or lower and at a temperature of 850° C. or higher and 1200° C. or lower.

FIELD OF THE INVENTION

The present invention relates to a method of producing AlN single crystals by means of flux method and AMN single crystals.

BACKGROUND ARTS

Aluminum nitride has a band gap of 6.2 eV and a high thermal conductivity, so that it is excellent as a substrate material of a light emitter (LED, LD) of ultra-violet region and an electronic device. It has been desired a development of a production technique of a semiconductor wafer. Until now, it has been proposed production techniques of AlN single crystal such as sublimation and HVPE methods. It has been further disclosed a technique of producing AlN according to flux method (solution method) in Japanese patent publication 2003-119099A and “Mat. Res. Bull. ” Vol. 9 (1974), pages 331 to 336. A transition metal is used as flux in Japanese patent publication 2003-119099A. AlN single crystal is obtained from Ca₃N₂ and AlN powder in “Mat. Res. Bull.” Vol. 9 (1974), pages 331 to 336.

It has recently been reported that a bulk of gallium nitride single crystal of a high quality can be synthesized at a relatively low temperature and a low pressure by using Na as a catalyst (Japanese patent publication 2000-327495A). The raw materials are gallium and sodium azide

Further, according to “Phys. Stat. Sol. ” Vol. 188 (2001) pages 415 to 419, crystal of AlGaN solid solution (size: 300 to 500 microns, composition; Al_(0.22)Ga_(0.78)N) could be successfully grown at a pressure of about 100 to 110 atms (10 to 11 MPa) from 750° C. to 800° C. using raw materials of sodium azide, gallium and aluminum.

DISCLOSURE OF THE INVENTION

According to prior arts of Japanese patent publication 2003-119099A, “Mat. Res. Bull. ” Vol. 9 (1974), pages 331 to 336 and the like, it has not been successfully grown AlN single crystal having a large size and high quality (low defect density). According to “Phys. Stat. Sol. ” Vol. 188 (2001) pages 415 to 419, although it has been successfully grown single crystal of AlGaN solid solution containing a small amount of Al, AlN single crystal is not described or suggested.

An object of the present invention is to provide a novel method of growing AlN single crystal.

Another object of the present invention is to provide AlN single crystal of a high quality.

The present invention provides a method of producing an AlN single crystal, the method comprising the step of:

pressurizing a melt comprising at least gallium, aluminum and a flux comprising sodium in an atmosphere comprising nitrogen to grow an AlN single crystal.

The present invention further provides an AlN single crystal grown by the method.

The present inventors have successfully grown AlN single crystal without precipitating GaN crystal, by pressurizing a melt comprising at least gallium, aluminum and a flux comprising sodium in an atmosphere comprising nitrogen, and have reached the present invention.

BEST MODES FOR CARRYING OUT THE INVENTION

According, to the present invention, a melt comprising at least gallium, aluminum and sodium is pressurized in an atmosphere comprising nitrogen to grow AlN single crystal. It has been further found that this is not limited to gallium and may be applied to, for example, indium (In), lithium (Li), zinc (Zn), bismuth (Bi) or the like.

A substrate of AlN single crystal and an AlN template having an underlying substrate and a thin film of AlN single crystal formed thereon are preferred as a seed crystal. As the underlying substrate, various substrates, such as a sapphire substrate, GaAs substrate, GaAIAs substrate, GaP substrate, InP substrate, silicon substrate, SiC substrate or the like, may be used. The thickness of the AlN thin film is not particularly limited. The thin film, however, takes a role of selectively generating nuclei for growing bulk crystal, so that the thickness may be basically thin as possible as far as the thin film can take the above role.

The AlN thin film may be formed or deposited by means of gaseous phase process, such as MOCVD, HVPE, laser CVD, laser ablation, reactive ion sputtering, reactive ion plating, cluster ion film-formation or the like, or another process.

A raw material for nitrogen may be nitrogen gas or ammonia, as well as compounds containing sodium and nitrogen such as Na azide, Na azine, Na hydrazide or the like. A material for aluminum is preferably aluminum metal, and aluminum nitride powder can be used. A material for gallium is preferably gallium metal, and gallium nitride powder can be used.

According to a preferred embodiment, AlN single crystal is grown under a nitrogen partial pressure of 50 atms or lower. The inventors have found that only AlN single crystal can be precipitated and the precipitation of a nitride of an element other than aluminum, such as GaN, is suppressed at such low pressure region. On the viewpoint, the nitrogen partial pressure of nitrogen may preferably be 40 atms or lower and more preferably be 30 atms or lower. Further, the nitrogen partial pressure may preferably be 1 atms or higher for facilitating the dissolution of nitrogen into raw materials.

The atmosphere comprising nitrogen may be consisting only of nitrogen or may contain a gas other than nitrogen. The gas other than nitrogen includes argon. In the case that the nitrogen-containing atmosphere contains a gas other than nitrogen, the total pressure of the atmosphere may preferably be 50 atms or higher and more preferably be 100 atoms or higher, on the viewpoint of suppressing the evaporation of the flux. Further, when the total pressure of atmosphere exceeds 2000 atms, the densities of the high pressure gas and the growing solution are approaching each other so that it becomes difficult to hold the growing solution in a crucible. The total pressure of the atmosphere is thus preferably 2000 atms or lower.

Further, although the growing temperature may be appropriately selected. AlN tends to be selectively precipitated at a relatively high growing temperature, and, for example, it may preferably be 850° C. or higher and more preferably be 900° C. or higher. Although the upper limit of the growing temperature is not particularly limited, the temperature may preferably be 1200° C. or lower and more preferably be 1100° C. or lower, for avoiding the increase of the vapor pressure of Na.

Among the materials forming the flux, the molar ratios of Ga, Al and Na are not particularly limited, as far as the phase separation is avoided. However, the ratio of Al may preferably be 100 to 10 mol and the ratio of Na may preferably be 10 to 300 mol, with respect to 100 mol of Ga. Further, in the case that indium (In), lithium (Li), zinc (Zn), bismuth (Bi) or the like, is added, the ratio of gallium may be decreased by the ratio of the added element (addition by replacement) or the element may be added to the whole composition (external addition). Further, two or more of the elements may be added at the same time.

EXAMPLES Example 1

Ga (purity of 99.999 percent), Al (purity of 99.999 percent) and Na (purity of 99.95 percent) were weighed in a glove box so that Ga:Al:Na are 1:1:2 in the molar ratios. The weighed raw materials were filled in an alumina crucible. Further, an AlN template (produced by forming an aluminum nitride thin film of a thickness of 1 μm on a sapphire single crystal wafer by epitaxial growth) was used as a seed crystal. The alumina crucible and AlN template were contained in a pressure container of stainless steel. Mixed gases of nitrogen-argon (10 percent of nitrogen gas) was used as the atmosphere and the temperature and pressure were elevated to 1200° C. and 500 atms, respectively (nitrogen partial pressure of 50 atms). It was then held at 1200° C. and 500 atms for 100 hours. As a result, it was confirmed that aluminum nitride single crystal of a thickness of about 1 mm was grown on the AlN template. Further, gallium nitride was not precipitated.

The presence or absence of gallium nitride was confirmed as described below. After the experiment, solid components remaining in the crucible was removed, granulated and subjected to powdery X-ray diffraction analysis to prove that characteristic diffraction peaks corresponding to GaN were not confirmed.

Example 2

The experiment was carried out according to the same procedure as the example 1, except that nitrogen gas was used as the atmospheric gas and the pressure and temperature during the growth were made 10 atms and 850° C., respectively. As a result, it was confirmed that aluminum nitride single crystal of a thickness of about 200 μm was grown on the AlN template. Gallium nitride was not precipitated.

Example 3

The experiment was carried out according to the same procedure as the example 1, except that 50 percent of gallium was replaced with indium having a purity of 99.999 percent (addition by replacement) and the temperature was made 1000° C.

As a result, it was confirmed that aluminum nitride single crystal of a thickness of about 0.5 mm was grown on the AlN template. Further, gallium nitride and indium nitride were not precipitated.

The presence or absence of gallium nitride and indium nitride was confirmed as described below. After the experiment, solid components remaining in the crucible was removed, granulated and subjected to powdery X-ray diffraction analysis to prove that characteristic diffraction peaks corresponding to GaN and InN were not confirmed.

Example 4

The experiment was carried out according to the same procedure as the example 1, except that 10 percent of lithium having a purity of 99.999 percent was added to the whole composition (external addition) and the temperature was made 1000° C.

As a result, it was confirmed that aluminum nitride single crystal of a thickness of about 0.5 mm was grown on the AlN template. Further, gallium nitride and lithium nitride were not precipitated.

The presence or absence of gallium nitride and lithium nitride was confirmed as described below. After the experiment, solid components remaining in the crucible was removed, granulated and subjected to powdery X-ray diffraction analysis to prove that characteristic diffraction peaks corresponding to GaN and Li3N were not confirmed.

Comparative Example 1

The experiment was carried out according to the same procedure as the example 2, except that the pressure during the growth was made 100 atms. However, AlGaN crystal containing a small amount of Al was grown on the AlN template and AlN single crystal was not obtained. 

1. A method of producing an AlN single crystal, the method comprising the step of: pressurizing a melt comprising at least gallium, aluminum and sodium in an atmosphere comprising nitrogen to grow an AlN single crystal.
 2. The method of claim 1, wherein said AlN single crystal is grown at a nitrogen partial pressure at which GaN single crystal is not precipitated.
 3. The method of claim 1, wherein said melt comprises one or more element(s) selected from the group consisting of indium, lithium, zinc and bismuth.
 4. The method of claim 1, wherein said AlN single crystal is grown at a temperature of 850° C. or higher and 1200° C. or lower.
 5. The method of claim 1, wherein said atmosphere during the growth has a nitrogen partial pressure of 1 atm or higher and 50 atms or lower.
 6. An AlN single crystal grown by the method of claim
 1. 